Isolation trenches with protected corners

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

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438435, 438437, 148DIG50, H01L 2176

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active

059813563

ABSTRACT:
A method for forming trench isolation with spacers on the corners where the silicon and oxide intercept. A cavity is formed in silicon with a mask. Prior to completely removing the mask, the mask is further etched to enlarge the upper portion of the cavity. The cavity is filled with oxide, which is subsequently etched to produce a dome-shaped cap, protective of sharp silicon corners that would otherwise upset electrical characteristics of transistors.

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