Apparatus for enclosing semiconductors with resin by molding

Details Apparatus for enclosing semiconductors with resin by molding Apparatus for enclosing semiconductors with resin by molding

1982-12-03

1985-04-16

Lowe, James

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

29588, 26427217, 2643284, 425121, 425125, 425444, 425544, 425DIG228, B29G 300

Patent

active

045113173

ABSTRACT:
Apparatus for enclosing semiconductors with resin by molding, including a stationary upper mold having a plurality of pots, and a movable lower mold opposed thereto.
The upper and lower molds have cavities to which a resin material supplied to the pots is pressingly injected directly or only through gates.
Disposed at the upper mold side is a resin material pressurizing mechanism having plungers fittable into the pots, and one or more cylinders and piston rods for actuating the plungers.

REFERENCES:
patent: 2428275 (1947-09-01), Frankwich et al.
patent: 2463401 (1949-03-01), Lyons
patent: 3672046 (1972-06-01), Storey et al.
patent: 4347211 (1982-08-01), Bandoh
patent: 4386898 (1983-06-01), Sera
"Runnerless Molding Without Hangups", Csaszar, SPE Journal, Feb. 1972, vol. 28, No. 2, pp. 20-23.

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