Control of the sintering of powdered metals

Details Control of the sintering of powdered metals Control of the sintering of powdered metals

1984-10-09

1986-07-08

Lechert, Jr., Stephen J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

419 9, 419 10, 419 19, 419 20, 419 34, 419 45, 419 58, 428432, 428548, 428551, 428553, 428639, 428689, B22F 300

Patent

active

045992770

ABSTRACT:
In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, an improvement is provided which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal or metal oxide which can be the same as or different from the metal of the aforesaid metal member.
The improved sintering process of the present invention is particularly adapted for use in the fabrication of multilayer ceramic substrates which serve as circuit modules for seminconductor chips.

REFERENCES:
patent: 4507262 (1985-03-01), Karas et al.

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