Thermal printhead manufacture

Details Thermal printhead manufacture Thermal printhead manufacture

1998-05-14

1999-11-09

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562755, 156278, 29832, 29854, 347 50, 257736, B41J 205, B32B 3128

Patent

active

059806826

ABSTRACT:
Thermal heater chip (1) is located within an opening of TAB circuit tape (5) and the TAB leads (3) are welded to the chip. This assembly is turned so that the underside of the leads face upward, and a curable, electrically insulative liquid is applied and cured to form a solid (11). The bottom of the chip is then attached to a heat radiating support (7) using heat conductive adhesive. The cured solid on the leads prevents any adhesive reaching the leads from causing an electrical shunt. The resulting printhead dissipates excess heat from the chip well from the support.

REFERENCES:
patent: 3653959 (1972-04-01), Kehr et al.
patent: 4811081 (1989-03-01), Lyden
patent: 4881318 (1989-11-01), Komuro et al.
patent: 5336564 (1994-08-01), Moldavsky
patent: 5442386 (1995-08-01), Childers et al.
patent: 5471097 (1995-11-01), Shibata
patent: 5530282 (1996-06-01), Tsuji
patent: 5538586 (1996-07-01), Swanson et al.

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