High performance flexible laminate

Details High performance flexible laminate High performance flexible laminate

1997-08-07

1999-01-26

Krynski, William

Stock material or miscellaneous articles

All metal or with adjacent metals

428209, 428606, 428615, 428344, 205 50, 205 77, 205148, 205170, B22D 300, B41M 520

Patent

active

058636668

ABSTRACT:
This invention relates to an improved high performance flexible laminate, comprising: a layer of electrodeposited copper foil overlying a layer of a flexible polymeric material, said copper foil being characterized by an ultimate tensile strength at 23.degree. C. of at least about 60,000 psi, a loss of ultimate tensile strength at 23.degree. C. of no more than about 15% after being annealed at 180.degree. C. for 30 minutes, an average grain size of up to about 1 micron, and a fatigue performance characterized by at least about 5000 cycles to failure when the strain amplitude is about 0.05% to about 0.2%. In one embodiment, the copper foil is electrodeposited using an electrolyte solution characterized by a free chloride ion concentration of up to about 4 ppm and an organic additive concentration of at least about 0.3 ppm.

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