Surface mount component height control

Details Surface mount component height control Surface mount component height control

1995-01-03

1998-03-10

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174261, 22818022, 257724, 361760, 361768, 361771, 361777, 361779, 361782, 361783, 439 68, 439 83, H05K 702

Patent

active

057268614

ABSTRACT:
A method and structure for controlling solder height of a surface mount device on a substrate uses electrical connection pads (105, 105') disposed onto a substrate (101). A height control pad (111) is also disposed onto the substrate (101) positioned apart from the electrical connection pads (105, 105'). Solder fillets (107, 107', 113) are disposed onto both the electrical connection pads (105, 105') and the height control pad (111). A component (103) having an electrical termination portion (109, 109') in contact with the solder fillets (107, 107') associated with the electrical connection pads (105, 105 ') and a body portion (115) in contact with the solder fillet (113) associated with the height control pad (111). The resulting structure (100 has a height relationship (119) between the surface mount component (103) and the substrate (101) controlled principally by a quantity of solder in the electrically conductive solder fillet (113) is disposed onto the height control copper pad (111) and a geometry of the copper pads (105) and (105') and the height control copper pad (111).

REFERENCES:
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 5173670 (1992-12-01), Naito et al.
patent: 5266748 (1993-11-01), Kawakami et al.
IBM Tech. Discl. Bulletin "Chip Mounting With Prestretched Joints" by V.D. Coombs vol. 16 No. 3 p. 767 Aug. 1973.
IBM Tech. Discl. Bul. "Chip With Lengthened Solder Joints Using Shape Memory Alloy" vol. 29 No. 12 p. 5213 May 1987.
IBM Tech. Discl. Bul. "Pin Support For IC Chip To Prevent CA Collapse During Reflow" vol. 30 No. 11 p. 320 Apr. 1988.
IBM Tech. Discl. Bul. "Circuit Board Stand-off To Reduce Thermal Fatigue" vol. 31 No. 9. p. 438 Feb. 1989.
IBM Tech. Discl. Bul. "Process For Forming A High-Aspect-Ratio Solder Interconnection" vol. 32 No. 6B p. 180 Nov. 1985.

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