Semiconductor device

Details Semiconductor device Semiconductor device

1980-08-26

1983-07-05

Larkins, William D.

357 70, 357 74, 357 81, H01L 2330, H01L 2336

Patent

active

043921515

ABSTRACT:
A semiconductor element is disposed in a recess at the bottom of a flanged metallic casing through a solder layer. An electrically insulating, molded plate is fixed to the casing by having protrusions fitted into holes disposed in opposite flanges of the casing and also two opposite L-shaped members abutting against adjacent lateral walls of the casing. Six strip-shaped leads buried in and extended from the molded plate are arranged to be soldered at first ends to associated solder electrodes on the exposed surface of the semiconductor element. The element and L-shaped members are burried in a resinous material molded within the casing.

REFERENCES:
patent: 3763403 (1973-10-01), Lootens
patent: 3820153 (1974-06-01), Quinn
patent: 3870944 (1975-03-01), Ogawa et al.
patent: 3920114 (1975-12-01), Hodge
patent: 3984739 (1976-10-01), Mochizuki et al.
patent: 4107727 (1978-08-01), Ikezawa et al.
patent: 4128801 (1978-12-01), Gansert et al.
patent: 4330790 (1982-05-01), Burns

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