Method for restraining circuit board warp during area array rewo

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29743, 29760, 29DIG24, 29DIG44, 228212, 228221, 22818021, H05K 334, H05K 1304

Patent

active

058625887

ABSTRACT:
A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

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patent: 5615477 (1997-04-01), Sweitzer

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