Fine-patterned thick film conductor structure and manufacturing

Details Fine-patterned thick film conductor structure and manufacturing Fine-patterned thick film conductor structure and manufacturing

1980-12-22

1983-07-05

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

219216, 219543, 336200, 427 96, H05K 102

Patent

active

043920136

ABSTRACT:
In manufacturing a fine-patterned thick film conductor structure, a thin film conductor layer having a film thickness of 0.1-10 .mu.m is formed on an insulating substrate and conductive material is then electroplated on the thin film conductor layer to the thickness of 34.9-190 .mu.m under the condition of a cathode current density of no less than 5 A/dm.sup.2. In patterning the conductors, a film thickness-to-conductor interspacing ratio is selected to be no less than 1.4 to prevent widthwise thickening of the conductors in the electroplating process. Resulting conductor structure has a circuit density of no less than 5 lines/mm and a film thickness of 35-200 .mu.m. It is useful for a high density printed circuit board and a miniature coil.

REFERENCES:
patent: 3269861 (1966-08-01), Schneble et al.
patent: 3432922 (1969-03-01), Yamada
patent: 4017890 (1977-04-01), Howard et al.
patent: 4136274 (1979-01-01), Shibata et al.
patent: 4187485 (1980-02-01), Wollnik
patent: 4250375 (1981-02-01), Tsutsumi et al.
patent: 4259564 (1981-03-01), Okkubo et al.
patent: 4298786 (1981-11-01), Marciniec

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