Method of producing wiring structures for electronic materials

Details Method of producing wiring structures for electronic materials Method of producing wiring structures for electronic materials

1991-05-06

1993-06-22

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437190, 437228, H01L 2124, H01L 21465

Patent

active

052216403

ABSTRACT:
Methods for the production of wiring structures are disclosed which are rendered suitable, particularly for use in semiconductors. An electrically conductive material of a selected class is refilled, in a specified manner and by the bias ECR-CVD system, into the connecting hole positioned on a substrate. This is conducive to voidless refilling of the connecting hole and also to thin lamination of the electrically conductive material on a wiring region.

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patent: 5001077 (1991-03-01), Sakai
patent: 5019531 (1991-05-01), Awaya et al.
patent: 5106786 (1992-04-01), Brady et al.

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