Dual printed circuit card mount assembly

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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361412, H05K 720

Patent

active

041077601

ABSTRACT:
An assembly is described for providing an effective, yet comparatively inexpensive means of mounting a pair of high density printed circuit cards. The assembly provides maximum air passages between the card assemblies as well as over the outer surfaces thereof in applications where forced cooling air is provided. However, the assembly also finds particular application where the circuit cards are installed in a sealed air-tight electronic equipment housing and reliance must be had to conductive cooling.

REFERENCES:
patent: 2945989 (1960-07-01), Vogel et al.
patent: 3141998 (1964-07-01), Silkman
patent: 3147402 (1964-09-01), Hochstetler
patent: 3184645 (1965-05-01), Schaeffer
patent: 3364395 (1968-01-01), Donofrio et al.
Jackson et al, "Heat Transfer Structure for Electronic Subassemblies", IBM Tech. Disc. Bull vol, 13, No. 12, May 71.

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