Semiconductor component with pressure contact

Details Semiconductor component with pressure contact Semiconductor component with pressure contact

1975-07-15

1977-02-15

Wojciechowicz, Edward J.

357 68, 357 79, H01L 2302, H01L 2348, H01L 2342

Patent

active

040084876

ABSTRACT:
The present invention is directed to a semiconductor device incorporating a semiconductor element which is provided with a housing having at least a base member, a top member and an insulator member which connects the base and top members, the housing having enclosed within it a semiconducting element which is clamped in place between two electrodes by means of at least one spring, the semiconducting element being electrically connected to the electrodes by a thin layer of soft solder, the semiconductor device being provided with a current supply lead which is in contact with at least one of the exterior faces of the housing.

REFERENCES:
patent: 2889498 (1959-06-01), Boyer et al.

Affiliated with

Also associated with

Rating

Semiconductor component with pressure contact does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor component with pressure contact, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component with pressure contact will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1439888