Method of curing adhesive

Details Method of curing adhesive Method of curing adhesive

1982-06-23

1983-07-05

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156109, 1562722, 1562751, 1562755, 156359, 219358, C03C 2700

Patent

active

043916635

ABSTRACT:
A method is provided for rapidly and thoroughly curing a heat curable adhesive substance by application of radiation heat energy without excessive temperature elevation of the adhesive substance. The method comprises the controlled application of radiation heat energy to the adhesive substance for elevating the exposed surface of the adhesive substance to a predetermined maximum temperature level. The radiation heat energy is then alternately removed from the adhesive substance to allow the exposed surface to cool partially, and resupplied to the adhesive substance to reheat the exposed surface to the predetermined maximum temperature level. This alternating controlled application of the radiation heat energy produces a thermal oscillation within the adhesive substance resulting in a rapid temperature rise and corresponding rapid cure time of portions of the adhesive substance not directly exposed to the radiation heat energy.

REFERENCES:
patent: 3560290 (1971-02-01), Sendor et al.
patent: 3616319 (1972-02-01), Auld
patent: 4110148 (1978-08-01), Rochell
patent: 4140050 (1979-02-01), Giddings

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