Thermoplastic polyamide hot melt adhesive composition

Details Thermoplastic polyamide hot melt adhesive composition Thermoplastic polyamide hot melt adhesive composition

1981-06-05

1982-11-16

Lieberman, Paul

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525426, C08L 7700

Patent

active

043595561

ABSTRACT:
Hot melt adhesive compositions are provided which contain 40-98 weight % of a thermoplastic polyamide resin derived from a dimer acid and a low molecular weight aliphatic diamine, and 2-60 weight % of an alkenyl succinic anhydride.

REFERENCES:
patent: 2638449 (1953-05-01), White
patent: 3375300 (1968-03-01), Ropp
patent: 3484403 (1969-12-01), Brunson
patent: 4158664 (1979-06-01), Selwitz

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