Method for providing mounting assemblies for a plurality of tran

Details Method for providing mounting assemblies for a plurality of tran Method for providing mounting assemblies for a plurality of tran

1975-04-21

1976-02-10

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29591, 174 52FP, B01J 1700

Patent

active

039369285

ABSTRACT:
A mounting assembly for a power transistor integrated circuit chip having a pair of electrodes on one surface thereof comprising base and emitter connections and a third electrode on the opposite surface thereof comprising the collector connection, is fabricated by the method including the steps of providing an electrically conductive strip having a central cavity extending the length thereof, the depth of the cavity being substantially equal to the height of the chip and the strip also including arms extending outwardly at opposite sides of the cavity; tinning the strip with solder; placing transistor chips in the cavity adjacent each other with the collector electrodes thereof being in contacting engagement with the strip; heating the strip with the chips therein to reflow the solder for connecting the chips thereto at the collector electrode; and severing the strip transverse the length thereof between chips to provide individual power transistor chip mounting assemblies each having a pair of outwardly extending support feet formed from the severed arms of the strip. The mounting assembly can be mounted to printed circuit conductors which are in-line by soldering the support feet to predetermined ones of the conductors and the base and emitter electrodes to others of the conductors.

REFERENCES:
patent: 2964431 (1960-12-01), Kalish
patent: 3254274 (1966-05-01), Garcia
patent: 3271507 (1966-09-01), Elliott
patent: 3494022 (1970-02-01), Maute
patent: 3549782 (1970-12-01), Reifel
patent: 3577633 (1971-05-01), Homma
patent: 3691289 (1972-09-01), Rohloff

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