Method and apparatus for a stress relieved electronic module

Details Method and apparatus for a stress relieved electronic module Method and apparatus for a stress relieved electronic module

1994-09-26

1996-04-09

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 257713, 257777, 361689, H05K 720

Patent

active

055067530

ABSTRACT:
A fabrication method and resultant electronic module that facilitates relief of thermally induced stress within the module. The fabrication method includes providing a plurality of integrated circuit chips having grooves in substantially planar main surfaces thereof. The chips are stacked and bonded to each other using an expandable material and a flowable adhesive to form an electronic module. The bonding is such that movement of individual IC chips within the module, in a direction perpendicular to their planar surfaces, is restricted. Upon thermal expansion of the module, the expandable material and the individual chips expand at different rates. However, the expandable material flows into the grooves, relieving thermally induced stress.

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WO-093023982 PCT Int'l Appl., Nov. 1993, 361/735.
IBM Tech Disclosure Bulletin, "Stacked Surface Mount Package with Interposing Heat Sink", vol. 33, No. 1B, Jun. 1990, 361/710, p. 276.

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