Split lead package

Details Split lead package Split lead package

1988-05-16

1990-12-18

Hille, Rolf

357 71, 357 74, H01L 2348, H01L 2944

Patent

active

049790161

ABSTRACT:
A multi-layer integrated circuit package uses split or bifurcated leads on separate levels, connected in parallel, for conducting the power supply voltages to an integrated circuit chip inside the package. The bifurcated leads are joined at the external pins of the package, and are split adjacent the die bond site of the package. The split ends provide separate power supply voltage conductors to the output driver circuitry on the integrated circuit chip and to the other circuitry in the integrated circuit chip. The effects of the transient currents induced in the power supply leads of the package are substantially isolated from the power supply voltages applied to the other circuitry of the integrated circuit chip.

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