Method and apparatus for improved ion dose accuracy

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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2504411, 414217, H01J 3718

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046804749

ABSTRACT:
The implant chamber pressure during ion implantation is controlled within a specified intermediate pressure range higher than the baseline pressure. Implanted dose errors resulting from neutralizing collisions of the beam with residual gas molecules are held constant and can be compensated. The pressure is maintained within the specified intermediate pressure range by a control system including a controllable vacuum valve associated with a vacuum pump, a chamber pressure sensor and a valve controller responsive to the pressure sensor. The valve controller opens and closes the valve to maintain the chamber pressure within the specified range after introduction of a wafer.

REFERENCES:
patent: 4449885 (1984-05-01), Hertel et al.
K. Steeples, "Dose Control with High Power Ion Beams on Photoresist Masked Targets", J. Vac. Sci. Technol. B2(1), Jan.-Mar. 1984, pp. 58-62.
G. Ryding et al., 10th International Conference on Electron and Ion Beam Science and Technology, Montreal (1982), pp. 366-371.
G. Ryding et al., "Dose Control for Ion Implantation", Microelectronic Manufacturing and Testing", Feb. 1983, pp. 17-19.
G. Ryding, Poceedings of the Fourth International Conference on Ion Implantation Equipment and Techniques, Springer Verlag (1983), pp. 274-290.

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