Semiconductor device with bonding pad contacts

Details Semiconductor device with bonding pad contacts Semiconductor device with bonding pad contacts

1989-11-21

1990-12-18

Mintel, William

357 41, 357 71, 357 68, 357 65, H01L 2702

Patent

active

049790129

ABSTRACT:
A semiconductor device having a metal interconnect feature which comprises an array of metal features. Each of the metal features in the array has a size not substantially larger than a predetermined feature size. The metal features in the array are connected together by a metal layer deposited over the array of metal features.

REFERENCES:
patent: 3872495 (1975-03-01), Geller et al.
patent: 4177095 (1979-12-01), Nelson
patent: 4491856 (1985-01-01), Egawa et al.
patent: 4631569 (1986-12-01), Calhoun
patent: 4649413 (1987-03-01), Kelly
patent: 4689657 (1987-08-01), Percival et al.

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