Method of making an aluminum contact

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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Details

438633, 438645, 438699, 438701, H01L 21302

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active

058541403

ABSTRACT:
A method of forming aluminum contacts of submicron dimensions wherein, after formation of both vias and line openings in a silicon oxide layer, a metal stop layer is deposited, followed by deposition of aluminum. Alternatively, the metal stop layer is deposited prior to forming the vias and line openings. The excess aluminum is removed by chemical-mechanical polishing, the stop layer providing high selectivity to the chemical mechanical polishing. The stop layer is then removed. The resultant silicon oxide-aluminum surface is planar and undamaged by the chemical-mechanical polishing step.

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