Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1996-12-13
1998-12-29
Utech, Benjamin
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438633, 438645, 438699, 438701, H01L 21302
Patent
active
058541403
ABSTRACT:
A method of forming aluminum contacts of submicron dimensions wherein, after formation of both vias and line openings in a silicon oxide layer, a metal stop layer is deposited, followed by deposition of aluminum. Alternatively, the metal stop layer is deposited prior to forming the vias and line openings. The excess aluminum is removed by chemical-mechanical polishing, the stop layer providing high selectivity to the chemical mechanical polishing. The stop layer is then removed. The resultant silicon oxide-aluminum surface is planar and undamaged by the chemical-mechanical polishing step.
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Jaso Mark A.
Palm Herbert
Poetzlberger Hans Werner
Braden Stanton C.
Goudreau George
International Business Machines - Corporation
Siemens Aktiengesellschaft
Utech Benjamin
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