Method for spray-cooling a tunable semiconductor device

Details Method for spray-cooling a tunable semiconductor device Method for spray-cooling a tunable semiconductor device

1997-11-12

1998-12-29

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

H01L 2144, H01L 2148, H01L 2150

Patent

active

058540920

ABSTRACT:
The method includes providing a substrate (18) having a semiconductor die (12) thereon, the semiconductor die having a major surface (23); disposing an input region (24) an active region (32) and a conductive region (34) on the major surface, the conductive region electrically coupling the input region and the active region; providing an inductive metal region (42) in communication with the input region, the inductive metal region sized to allow real-time iterative tuning of the electronic device; and receiving a fluid by a nozzle (60), the nozzle atomizing the fluid and discharging the fluid onto the major surface.

REFERENCES:
patent: 4839774 (1989-06-01), Hamburgen
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5606202 (1997-02-01), Lutz
Joseph Fjelstad, "Flexible Circuits for Packaging Semiconductor Chips?", Circuitree, Jan. 1996, pp. 68-70.

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