Multi-layer tab tape having distinct signal, power and ground pl

Details Multi-layer tab tape having distinct signal, power and ground pl Multi-layer tab tape having distinct signal, power and ground pl

1996-04-24

1998-12-29

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437214, 437217, 437219, H01L 2160

Patent

active

058540857

ABSTRACT:
Separate and distinct conductive layers for power and ground are insulated from one another and a patterned signal conductive layer to form a flexible substrate for mounting a semiconductor die in a semiconductor device assembly. TAB technology is utilized to produce an assembly that has superior electrical characteristics because power and ground is conducted on separate low impedance conductive layers. The power and ground leads connecting the semiconductor die and external circuits are selected from the signal trace layer, cut bent downward and attached by bonding to the respective power or ground layer. A tool is disclosed for cutting the selected leads. A method of attaching solder balls to a TBGA film using solder flux and photoimageable solder resist definition is also disclosed.

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patent: 5409865 (1995-04-01), Karnezos

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