Plasma processing device

Details Plasma processing device Plasma processing device

1990-04-06

1990-12-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118 501, 118620, 118728, 156643, 20429831, B44C 122, C23C 1400, B05B 502, C03C 1500

Patent

active

049784129

ABSTRACT:
A plasma processing device intended to plasma-process a wafer which is mounted on a mount in the plasma process vessel and clamped at the peripheral rim thereof between a clamping member and the mount. The wafer thus processed can be then handled when it is released from its clamped state. A plate spring is housed like a cantilever in a part of that portion of the clamping member which clamps the wafer relative to the mount, and a free end of the plate spring is projected from a recess which is formed on the underside of the clamping member to house the free end. When the wafer is clamped between the clamping member and the mount, the free end is housed in the recess, but when the wafer is released from its clamped state, the free end is projected from the recess to separate it from the clamping member. The wafer can therefore be left on the mount without adhering to the clamping member.

REFERENCES:
patent: 4615755 (1986-10-01), Tracy et al.
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4931135 (1990-06-01), Horiuchi et al.

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