Method and apparatus for processing substrates

Details Method and apparatus for processing substrates Method and apparatus for processing substrates

1997-08-07

1998-12-29

Beck, Shrive

Coating processes

Spraying

427240, 427420, 427424, 118302, 118321, 118323, B05D 102, B05B 300, B05B 100

Patent

active

058538127

ABSTRACT:
A method for processing substrates, comprising the steps of (a) disposing a substrate on a supporting table, followed by preparing a nozzle and a contact adjusting member in a waiting position apart from the substrate disposed on the supporting table and further preparing removing means in a position intermediate between the waiting position and an operating position, (b) allowing a solvent to be attached to the contact adjusting member in the waiting position and moving the contact adjusting member relative to the nozzle so as to bring the process solution present in the solution discharge port of the nozzle into contact with the solvent attached to the contact adjusting member and, thus, to adjust the condition of the process solution present in the solution discharge port of the nozzle, (c) moving the nozzle from the waiting position to an operating position through the removing means so as to allow the process solution spurted from the nozzle to be moved into the removing means, and (d) moving the substrate and the nozzle relative to each other while allowing the process solution to be spurted from the nozzle so as to form a film of the process solution on the substrate.

REFERENCES:
patent: 2899929 (1959-08-01), Monroe
patent: 3635054 (1972-01-01), Amidon, Jr.
patent: 3797453 (1974-03-01), Rizzo
patent: 3989569 (1976-11-01), Newman
patent: 4244200 (1981-01-01), Sando et al.
patent: 4387002 (1983-06-01), Knecht
patent: 4416213 (1983-11-01), Sakiya
patent: 4530306 (1985-07-01), Hovekamp
patent: 5002008 (1991-03-01), Ushijima et al.

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