Thick bus metallization interconnect structure to reduce bus are

Details Thick bus metallization interconnect structure to reduce bus are Thick bus metallization interconnect structure to reduce bus are

1990-11-19

1992-05-05

James, Andrew J.

357 67, 357 69, H01L 2348, H01L 2946, H01L 2954

Patent

active

051112760

ABSTRACT:
There is disclosed a structure for self aligned and non-self aligned power and ground buses and interconnects for integrated circuits which are thicker than normal conductors. This enables them to withstand higher current densities without adverse electromigration effects. There is also disclosed a method for making such structures.

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