Method of manufacture of additive printed circuitboards using pe

Details Method of manufacture of additive printed circuitboards using pe Method of manufacture of additive printed circuitboards using pe

1974-10-11

1976-09-21

Kendall, Ralph S.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427304, 427305, 427306, 427282, C23C 302

Patent

active

039820459

ABSTRACT:
Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by all-electroless deposition techniques, wherein the characterizing feature of the invention is the use of a separate acceleration step after catalyzing and prior to application of a resist mask, supplementary of the usual post-masking accelerating step. Improved surface resistivity or insulation resistance in the printed circuit board and improved adhesion of the electrolessly deposited metal are achieved.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley
patent: 3607352 (1971-09-01), Fadgen et al.
patent: 3698940 (1972-10-01), Mersereau et al.

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