Method of arranging alignment marks

Details Method of arranging alignment marks Method of arranging alignment marks

1994-08-19

1996-03-05

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437924, 148DIG102, H01L 21461

Patent

active

054967775

ABSTRACT:
Alignment marks used in different processes are arranged on scribing lines. The scribing lines are used for cutting off individual semiconductor devices formed on a wafer, and the alignment marks have widths which are larger than widths of the scribing lines. The width of areas corresponding to position where alignment marks are formed area enlarged so as to accommodate the alignment marks within the areas. A part of the area a used alignment mark is covered with a new film so that the area is permitted to have a scribing line having a desired width every time a used alignment is generated. A new alignment mark is arranged within other areas where an alignment mark is not formed. In such an arrangement of the alignment marks, the center line of the scribing line is made clear and the area where the semiconductor devices are formed can be made large.

REFERENCES:
patent: 4233091 (1980-11-01), Kawabe
patent: 5314837 (1994-05-01), Barber et al.
patent: 5316984 (1994-05-01), Leourx
S. Wolf, "Silicon Processing For the VLSI EVA" Lattice Press 1990, pp. 196-198, vol. II.

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