Thick film and thin film composite substrate and electronic circ

Details Thick film and thin film composite substrate and electronic circ Thick film and thin film composite substrate and electronic circ

1990-07-10

1992-05-05

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428137, 428209, 428433, 4284735, 428901, 361397, 361414, 174255, 174256, B32B 300, B32B 2714

Patent

active

051106647

ABSTRACT:
A thick film and thin film composite wiring substrate for mounting integrated circuit chips thereon, comprising a thin film substrate including a signal wiring layer therein, a thick film substrate laminated together with the thin film substrate, and at least a part of signal wiring being formed as a signal wiring layer included in the thick film substrate.

REFERENCES:
patent: 4407007 (1983-09-01), Desai
patent: 4665468 (1987-05-01), Dohya
patent: 4672152 (1987-06-01), Shinohara
patent: 4685033 (1987-08-01), Inoue
patent: 4706164 (1987-11-01), Takenaka
patent: 4754371 (1988-06-01), Nitta
patent: 4816323 (1989-03-01), Inoue
patent: 4922377 (1990-05-01), Matsumoto
Y. Murano, "Water Cooling the Multichip Package", Nikkei Electronics, 1985 (Jun. 17), Nikkei Business Publications, Inc., pp. 243-266.

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