Process for making electrically conductive patterns

Details Process for making electrically conductive patterns Process for making electrically conductive patterns

1990-04-17

1992-05-05

Lowe, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156326, 427 96, 427123, 427125, 4271262, 427190, 427191, 427193, 427203, 4273761, B05D 512, C03B 2900

Patent

active

051103842

ABSTRACT:
A process for making an electrically conductive pattern on a substrate including forming a patterned adhesive layer on the substrate, applying a conductive metal powder to the adhesive layer, and in a second coating pass, applying a powder containing supplementary elements to the pattern. The patterned substrate is fired to volatilize theadhesive layer and sinter the powders. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.

REFERENCES:
patent: 3935366 (1976-01-01), Smith

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