Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1977-12-05
1981-02-24
Husar, Francis S.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 88, 156657, 204 15, 357 71, 357 54, 357 55, 357 23, 29571, 29579, B05D 512
Patent
active
042528402
ABSTRACT:
A method of manufacturing a semiconductor device which comprises the steps of forming an insulating layer on a semiconductor substrate; removing that region of the insulating layer which is to be used for an electrode contact spot, thereby forming a hole for electrode contact, removing that region of the insulating layer on which wiring is to be laid to the intermediate section of the thickness of said insulating layer, thereby providing a stepped section between the bottom of the specified wiring region of said insulating layer thus removed and the surface of said insulating layer; and depositing a metal layer all over the surface of the insulating layer and then cutting off at said stepped section the portion of the metal layer formed on the specified wiring region of said insulating layer from the other portions of the metal layer remaining on the surface of the insulating layer, thereby providing the prescribed wiring.
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Arbes C. J.
Husar Francis S.
Tokyo Shibaura Electric Co. Ltd.
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