Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-09-12
1992-05-05
Schwartz, Larry I.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 55, H01R 909
Patent
active
051102986
ABSTRACT:
An integral electrical interconnection is made between two circuit carrying substrates (100 and 110). The first circuit carrying substrate (100) contains one or more protrusions (102) on the peripheral edge of the substrate (100) which couples to a series of one or more apertures (104) on the peripheral edge of a second circuit carrying substrate (110). Both the tabs and the apertures are covered with conductive materials (202 and 210) also connected to the circuit.
REFERENCES:
patent: 3214725 (1965-10-01), De Rose et al.
patent: 3579206 (1971-05-01), Grange
patent: 3878341 (1975-04-01), Balde
patent: 3997236 (1976-12-01), Bresin
patent: 4366198 (1982-12-01), Ramspacher, Jr.
patent: 4513064 (1985-04-01), Marcus
patent: 4514708 (1985-04-01), Ludtke
patent: 4578739 (1986-03-01), McKee et al.
Branan Mac W.
Dorinski Dale W.
Dorinski Dale W.
Motorola Inc.
Nichols Daniel K.
Schwartz Larry I.
Vu Hien D.
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