Radiation hardened field oxides for NMOS and CMOS-bulk and proce

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357 238, 357 2312, 357 50, H01L 2978

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active

049909835

ABSTRACT:
The field oxide surrounding an NMOS device or the field oxide around the NMOS device and between the NMOS and PMOS devices in CMOS is split or notched to make at least one thin field oxide region under which a degenerative P+ region is formed in the substrate to increase threshold voltages of the undesired field oxide FET.

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patent: 3892609 (1975-07-01), Coppen
patent: 3974516 (1976-08-01), Steinmaier
patent: 4063274 (1977-12-01), Dingwall
patent: 4282648 (1981-08-01), Yu et al.
patent: 4458262 (1984-07-01), Chao
patent: 4613886 (1986-09-01), Chwang
patent: 4748489 (1988-05-01), Komatsu

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