Process for providing a landless via connection

Details Process for providing a landless via connection Process for providing a landless via connection

1994-11-04

1996-03-05

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174262, 427 96, H05K 336

Patent

active

054956650

ABSTRACT:
A process for connecting at least two electrically conductive patterns through a dielectric material by a landless electrical connection is provided. The process includes providing a composite containing a dielectric substrate having a conductive plane on at least one of its major surfaces and a temporary support layer covering the conductive plane. Blind vias are provided in the dielectric substrate and are plated with an electrically conductive material. The temporary support layer is removed thereby providing a landless electrical connection through the dielectric material and the conductive plane is available for providing external electrical conductive pattern.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3844799 (1974-10-01), Underkofler et al.
patent: 4066809 (1978-01-01), Alpaugh et al.
patent: 4152467 (1979-05-01), Alpaugh et al.
patent: 4478883 (1984-10-01), Bupp et al.
patent: 4528072 (1985-07-01), Kurosawa et al.
patent: 4554182 (1985-11-01), Bupp et al.
patent: 4704791 (1987-11-01), Chellis et al.
patent: 5065228 (1991-11-01), Foster et al.
patent: 5108553 (1992-04-01), Foster et al.
patent: 5263243 (1993-11-01), Taneda et al.
patent: 5315072 (1994-05-01), Arai et al.
patent: 5418689 (1995-05-01), Alpaugh et al.
Chumbres et al., Landless Plated-Through Hole Photoresist Masking Process, IBM Technical Disclosure Bulletin, vol. 15, No. 10, Mar. 1973, pp. 3298-3299.
Crimi et al., Landless Hole Circuit Card IBM Technical Disclosure Bulletin, vol. 9, No. 10, Mar. 1967, pp. 1310-1311.
Johnson, Wafer Voltage Distribution, IBM Technical Disclosure Bulletin, vol. 18, No. 6, Nov. 1975, p. 1851.
Howrilka et al., Improved, Rapid Process for Cleaning "Blind" Via Holes in a Circuit Board, IBM Technical Disclosure Bulletin, vol. 22, No. 4, Sep. 1979, p. 1417.

Affiliated with

Also associated with

Rating

Process for providing a landless via connection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for providing a landless via connection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for providing a landless via connection will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1405366