Semiconductor device and the manufacture thereof

Details Semiconductor device and the manufacture thereof Semiconductor device and the manufacture thereof

1988-09-20

1991-10-29

Wojciechowicz, Edward J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 72, 357 75, 357 81, 361395, 361400, 361405, 361412, 361413, H01L 3902, H05K 114, H01R 900

Patent

active

050619900

ABSTRACT:
A semiconductor device comprising: a wiring board having terminals; a sheet module including a sheet having a plurality of connection terminals and lead terminals, each connected to at least one of said connection terminals at one end and to one of the terminals of the board at the other end; a plurality of TAB-packaged IC devices, each having outer leads which are bonded to at least some of said connection terminals to mount the IC device on the sheet and to connect the IC device to the terminal of the wiring board, a method of manufacturing a semiconductor device comprising: the step including coating a metal layer on each of the front and the rear surfaces of a tape, forming through holes which make conduction between the front surface and the rear surface, etching the metal layers to leave a plurality of connection terminals connected to said through holes and lead terminals each connected to at least one of said plurality of connection terminals, subjecting portions other than the connection terminals and the lead terminals to insulation treatment, and forming a metal coating on arears not provided with the insulation treatment; the step of forming a module including preparing a plurality of TAB-packaged IC devices having outer leads, and bonding the outer leads of said plurality of IC devices to said connection terminals to mount the IC devices on the tape; and the step including cutting said module from said tape, and connecting said lead terminals to the terminals of a circuit board to mount the module on the circuit board.

REFERENCES:
patent: 4761881 (1988-08-01), Bora et al.
patent: 4949224 (1990-08-01), Yamamura et al.

Affiliated with

Also associated with

Rating

Semiconductor device and the manufacture thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and the manufacture thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and the manufacture thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1403267