Method of making semi-conductor mounts

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

29588, 29589, 29591, 29628, 29630C, 219118, 228173A, 228155, 228178, 357 81, H05K 500

Patent

active

040728170

ABSTRACT:
A method of making a mount for a solid state semi-conductor comprising a mounting part secured to a body element comprising the steps of positioning a mounting part in contact with a body element, applying heat to the body element in the region of the inter-face between the body element and the mounting part by conduction from the mounting part for a time and at a temperature to cause melting of the body element in the region of the inter-face and consequently to cause bonding of the mounting part to the body element.

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patent: 3197843 (1965-08-01), Nippert
patent: 3197857 (1965-08-01), Nippert
patent: 3279039 (1966-10-01), Nippert
patent: 3893226 (1975-07-01), Waite

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