Method of providing through hole plating between circuit element

Details Method of providing through hole plating between circuit element Method of providing through hole plating between circuit element

1984-03-29

1986-04-29

Smith, John D.

Chemistry: electrical and wave energy

Processes and products

427 97, 427282, H05K 342, H05K 346

Patent

active

045855285

ABSTRACT:
A method of providing through-hole plating between flexible circuit elements and rigid circuit elements is presented wherein a strong and reliable electrical connection is affected without damage to the conductive pattern of the flexible circuit elements. The method includes selectively providing removable masking material to portions of a flexible circuit element followed by nonelectrolytic plating and subsequent removal of the mask. An additional resist layer is also provided to selective areas followed by electrolytic plating and subsequent removal of the resist material.

REFERENCES:
patent: 3134690 (1964-05-01), Eriksson

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