Substrate attach adhesive film, application method and devices i

Details Substrate attach adhesive film, application method and devices i Substrate attach adhesive film, application method and devices i

1990-03-20

1991-10-29

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428323, 4284111, 428901, 428908, 116 60, B32B 900

Patent

active

050615491

ABSTRACT:
A heat activated adhesive film is disclosed, 2-15 mil thick, for bonding a circuit-printed substrate to its support. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, and one or more of the elements oxygen, nitrogen, sulfur, halogen in its repeating unit. The polymer's Vicat softening temperature is 70.degree.-280.degree. C. Optionally, the adhesive may also contain up to 45 volume percent of a thermally conductive inorganic filler of 0.5-20 micrometer particle size. The attachment process simply consists of heating and pressing the film, sandwiched between the adherent surfaces, above the melting temperature and cooling to ambient.

REFERENCES:
patent: 4248748 (1981-02-01), McGrath et al.
patent: 4568602 (1986-02-01), Stow

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