Mounting structure of piezoelectric element

Details Mounting structure of piezoelectric element Mounting structure of piezoelectric element

1993-10-08

1994-10-25

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361768, 361771, 310348, 310349, 310313R, H05K 702, H01L 4104

Patent

active

053594940

ABSTRACT:
An opening 11 is formed in a region of a circuit board 10 opposite to a vibration region E of a piezoelectric element 5. The piezoelectric element 5 is mounted on the circuit board 10, and electrode connection portions 9 of the piezoelectric element 5 are connected with and fixed to the circuit board by a solder. In succession, soldered connection portions kept away from the vibration region E of the piezoelectric element 5 are filled with a bonding agent 8. Thereupon, an excess bonding agent 8 with which the soldered connection portions are filled is eliminated by the opening 11, and hence is prevented from invading the vibration region E of the piezoelectric element 5. Further, any stress exerted on the circuit board 10 is dispersed because of its being mostly received by the bonding agent 8, and hence any stress exerted on the piezoelectric element 5 is reduced.

REFERENCES:
patent: 4967166 (1990-10-01), Marcellus

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