Trench-filling etch-masking microfabrication technique

Fishing – trapping – and vermin destroying

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437974, 216 2, 216 79, H01L 2176

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active

057704651

ABSTRACT:
A process is described for manufacturing submicron, ultra-high aspect ratio microstructures using a trench-filling etch masking technique. Deep trenches are etched into a substrate, the trenches are filled with an appropriate trench-filling material, and deep etching into the substrate is carried out with the trench-filling material serving as a mask.

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patent: 5372968 (1994-12-01), Lur
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patent: 5407860 (1995-04-01), Stoltz

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