Microbridge sensor bonding pad design for improved adhesion

Details Microbridge sensor bonding pad design for improved adhesion Microbridge sensor bonding pad design for improved adhesion

1988-12-16

1990-01-09

Goldstein, Herbert

Measuring and testing

Volume or rate of flow

Thermal type

29621, 338309, G01F 168, H01C 1728, H01C 1102

Patent

active

048919772

ABSTRACT:
An improved connector pad stack structure for use in microstructure devices having a silicon nitride surface in which the sensor metal such as platinum or Ni-Fe is eliminated from the pad bonding site and only adhesion promoting metals are used on the Si.sub.3 N.sub.4 to provide a stronger, more durable and reliable pad stack.

REFERENCES:
patent: 3996551 (1976-12-01), Croson
patent: 4129848 (1978-12-01), Frank
patent: 4396900 (1983-08-01), Hall
patent: 4501144 (1985-02-01), Higashi et al.
patent: 4683159 (1987-07-01), Bohrer et al.

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