Module interconnect adapter for reduced parasitic inductance

Details Module interconnect adapter for reduced parasitic inductance Module interconnect adapter for reduced parasitic inductance

1995-09-12

1997-05-13

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361784, 439 55, 439 65, H05K 111, H01R 909

Patent

active

056298390

ABSTRACT:
A mounting for a solderable component module (SCM.TM.) interconnect includes an elongated trench or blind via for receiving an edge of the module. The interconnect may be adjusted to reduce the parasitic inductance associated with the connection of the SCM interconnect and the motherboard. Preferably, the design of the finger connectors associated with the SCM interconnect or other board module can be adjusted to reduce parasitic inductance. Alternatively, the capacitance associated with the SCM interconnect or motherboard may be adjusted. The SCM interconnect preferably includes finger connectors which have a rectangular shape. The finger connectors preferably have a shape wherein the length is greater than the width and have an enhanced thickness which reduces parasitic inductance. The finger connectors are spaced close together.

REFERENCES:
patent: 5031072 (1991-07-01), Malhi et al.
patent: 5059557 (1991-10-01), Cragon et al.
patent: 5343366 (1994-08-01), Cipolla et al.
patent: 5484965 (1996-01-01), Woychik
patent: 5545924 (1996-08-01), Contolatis et al.

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