Metal ball grid array package with improved thermal conductivity

Details Metal ball grid array package with improved thermal conductivity Metal ball grid array package with improved thermal conductivity

1994-07-19

1997-05-13

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 174257, 174258, 257720, 257713, 257709, 361720, 361713, H05K 720, H01L 2334

Patent

active

056298358

ABSTRACT:
There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.

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