Soldering mask formed from a photosensitive resin composition an

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430284, 430325, 430396, 430330, 430531, G03C 500, G03C 178

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active

044991630

ABSTRACT:
A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.

REFERENCES:
patent: 3850770 (1974-11-01), Juna et al.
patent: 3930865 (1976-01-01), Faust et al.
patent: 4210713 (1980-07-01), Sumiyoshi et al.
patent: 4228232 (1980-10-01), Rousseau
patent: 4247576 (1981-01-01), Kotner
patent: 4250248 (1981-02-01), Faust
patent: 4268611 (1981-05-01), Okishi et al.

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