SOI trench DRAM cell for 256 MB DRAM and beyond

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 47, 437 60, H01L 218242

Patent

active

055939120

ABSTRACT:
A trench SOI structure is described. The structure is useful, for instance in the fabrication of DRAM cells. The structure can be fabricated by extending the conventional substrate plate trench cell. The SOI cell eliminates the parasitic trench sidewall leakage, reduces soft errors, eliminates well to substrate leakage, in addition to all the other advantages of SOI devices.

REFERENCES:
patent: 4326332 (1982-04-01), Kenney
patent: 5001526 (1991-03-01), Goutou
patent: 5096849 (1992-03-01), Beilstein et al.
patent: 5182224 (1993-01-01), Kim et al.
patent: 5204286 (1993-04-01), Doan
patent: 5214603 (1993-05-01), Dhong et al.
patent: 5262002 (1993-11-01), Grewal et al.
patent: 5283453 (1994-02-01), Rajeevakumar
patent: 5360758 (1994-11-01), Brommer
patent: 5422294 (1995-06-01), Noble, Jr.
N.C.C. Lu et al, IEEE J. Solid-State Circuits V. SC-21 (1986) p. 627 "A Substrate-Plate Trench-Capacitor (SPT) Memory Cell for Dynamic RAMS".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

SOI trench DRAM cell for 256 MB DRAM and beyond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with SOI trench DRAM cell for 256 MB DRAM and beyond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and SOI trench DRAM cell for 256 MB DRAM and beyond will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1387797

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.