Multi-layer molded plastic IC package

Details Multi-layer molded plastic IC package Multi-layer molded plastic IC package

1989-01-27

1990-01-02

Hille, Rolf

357 74, H01L 2310, H01L 2348, H01L 2312

Patent

active

048916870

ABSTRACT:
A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive coated insulation tape. A second insulating tape layer is used to bond externally extending leads onto one of the metal plates. Power and ground connections from the terminals of the integrated circuit are made to each of the plates, respectively, as are the power and ground lead connections to the two plates. The power and ground planes remove the requirement for direct physical connection between the power and ground terminals of the integrated circuit and their respective leads.

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patent: 4675717 (1987-06-01), Herrero et al.
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4705917 (1987-11-01), Gates et al.

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