Printed wiring board interconnect arrangement

Details Printed wiring board interconnect arrangement Printed wiring board interconnect arrangement

1983-08-29

1985-02-12

McQuade, John

Geometrical instruments

339 17M, H01R 909

Patent

active

044987170

ABSTRACT:
An arrangement of mounting printed wiring boards providing reduced backplane conductor congestion. The printed wiring boards are mounted in columns and interconnected within a column by conductors on interconnect planes. Connections between interconnect planes and between external terminations and the interconnect planes are accomplished by conductors on backplanes which connect to the interconnect planes. Congestion of backplane conductors is avoided by routing connections, not terminating to external points, directly from one interconnect plane to another interconnect plane by means of conductors on a cross-connect board connecting the two interconnect planes. The arrangement also includes a column between the backplane and the printed wiring boards which are mounted at an angle to the horizontal. Air flows through this column to cool the printed wiring boards by means of convection.

REFERENCES:
patent: 2955236 (1960-10-01), Luhn
patent: 3378730 (1968-04-01), Poehls
patent: 3430182 (1969-02-01), Blanche
patent: 3697815 (1972-10-01), Grant et al.
patent: 4237546 (1980-12-01), Wells

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