Method of manufacturing a semiconductor device having a cylindri

Details Method of manufacturing a semiconductor device having a cylindri Method of manufacturing a semiconductor device having a cylindri

1995-01-30

1996-04-09

Fourson, George

Fishing, trapping, and vermin destroying

437919, H01L 2170, H01L 2700

Patent

active

055061648

ABSTRACT:
The semiconductor memory device includes a semiconductor substrate 1 having a conductive layer 6 formed on its main surface. Word lines 4c, 4d and a bit line 11 is formed on the semiconductor substrate. Insulating films 8, 12 are provided to cover the word lines 4c, 4d and the bit line 11. A barrier film 14 is provided on the insulating films 8, 12 for protecting the insulating films 8, 12 from etchant. A cylindrical storage node 170 is electrically connected to the conductive layer 6. The cylindrical storage node 170 includes a bottom conductive portion 17a and a sidewall conductive portion 17b. An outer surface of the storage node 170 is covered with a capacitor insulating film 112. The outer surface of the cylindrical storage node 170 is covered with a cell plate 22, with the capacitor insulating film 112 interposed therebetween.

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