Apparatus for fabricating semiconductor lasers

Stock material or miscellaneous articles – All metal or with adjacent metals – Plural layers discontinuously bonded

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428620, 428636, 225 93, B28D 500, B26F 300, H01L 2178, H01L 21304

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056290977

ABSTRACT:
A semiconductor laser device, and method for making such, having higher operating temperatures than previously available. A semiconductor epitaxial layer is bonding to a cleaving assembly which allows the epitaxial layer to be manipulated without use of traditional substrate forms. The resulting semiconductor laser is bonded to a metal portion which serves as a heat sink for dissipating heat from the active lasing region. The resulting semiconductor lasers can be cooled by thermoelectric cooling modules, thus eliminating the necessity of using more bulky cryogenic systems.

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