Method of bonding semiconductor devices together

Details Method of bonding semiconductor devices together Method of bonding semiconductor devices together

1986-06-24

1987-09-15

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29840, 2281802, 228188, C25D 548

Patent

active

046937706

ABSTRACT:
Disclosed is a method of realizing high-density and inexpensive semiconductor apparatus by joining the electrodes of two semiconductor devices. A metal bump formed on a substrate is transferred and joined onto the electrode of first semiconductor device, and electrode of second semiconductor device and the metal bump transferred and joined on the first semiconductor device are positioned, pressed and heated, thereby joining the two semiconductor devices together.

REFERENCES:
patent: 4032058 (1977-06-01), Riseman
patent: 4273859 (1981-06-01), Mones et al.
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4494688 (1985-01-01), Hatada et al.
patent: 4585157 (1986-04-01), Belcher

Affiliated with

Also associated with

Rating

Method of bonding semiconductor devices together does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding semiconductor devices together, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding semiconductor devices together will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1382890