Apparatus and method for processing a semiconductor lead frame

Details Apparatus and method for processing a semiconductor lead frame Apparatus and method for processing a semiconductor lead frame

1984-10-01

1986-12-09

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

72427, H01R 4300

Patent

active

046271597

ABSTRACT:
Apparatus and a method for processing a semiconductor lead frame, such as deflashing a plurality of molded chip housings on the lead frame as they move along a predetermined path. A support has a pair of sides, and a track on each side respectively, one track guides lead frames upwardly in a first stack to a position laterally aligned with a die on a vertically movable die plate. The other track receives processed lead frames and allows the processed lead frames to be lowered in a second stack. A reciprocal shuttle member extending between said tracks strips off the uppermost lead frame from the first stack and moves it into a position beneath the die which is then lowered by a power device sequentially to process, i.e., deflash, the lead frame. Then, the die elevates, allowing the shuttle member to reverse so that it can pick up the top lead frame from the first stack to advance it along with the processed lead frame laterally, the processed lead frame being movable onto the second stack. The power device includes a tubular coil having an open end for receiving a magnetic core secured to the die plate. When a signal energizes the coil, a magnetic force attracts the core into the coil member, moving the die plate downwardly. A spring biases the die plate upwardly.

REFERENCES:
patent: 3364723 (1968-01-01), Gartside
patent: 4409733 (1983-10-01), Alemanni

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